Development of PVD-Coated Cermet Grade for General Machining of Steel
Kyocera Industrial Ceramics has announced the release of its new PV7025 PVD-coated cermet grade of indexable cutting tool inserts for general machining of steel. The new cutting tool has been developed based on Kyocera’s new proprietary MEGACOAT PVD coating technology offering superb wear and heat resistance, providing an excellent durability in high-speed machining, and when it is combined with a super micro-grain cermet substrate, the result is an exceptional cutting tool for steel machining. Read more
Release of Two New Inverters for use in Air-Conditioning and water Treatment Systems
Fuji Electric has announced the launch of FRENIC-HVAC inverter for use in air-conditioning equipment and FRENIC-AQUA inverter for use in water treatment systems. Both model feature slim design allowing the units to be installed against the wall. These units have been produced as specialized equipment loaded with the such functions to independently operate fans and pumps in air-conditioning equipment and water supply and drainage facilities. Read more
Development of 6-Axis Electronic Compass for Mobile Devices
Asahi Kasei Microdevices (AKM) has released its latest 6-axis electronic compass targeted at mobile devices such as smartphones and tablet PCs. The new AK8978 6-axis electronic compass is an optimal combo sensor for the compass function normally fulfilled by two separate components namely a 3-axis electronic compass and a 3-axis accelerometer which compensates for inclination angle allowing precise azimuth information to be obtained, resulting in reduction in number of components. Read more
Development of two New “RGBW Coding” and “HDR Movie” Functionality for Sony’s Newly developed Stack-Structured CMOS Image Sensor.
Sony has announced the development of two new functionality, one the “RGBW Coding” and other “HDR (High Dynamic Range) Movie” to be implemented into Sony’s newly developed stacked-structured CMOS image sensors. The “RGBW Coding” function will allow images to be captured with low noise and high picture quality even in low-light conditions, while the “HDR Movie” function will provide brilliant color to be captured even in bright settings. The built-in “RGBW Coding” function will add W (white) pixels to the conventional range of RGB pixels resulting in higher sensitivity. Read more
Release of Industrial Electronic Paper Display Platform
Epson has announced the release of e-paper platform for industrial applications. The platform comprised of electronic paper (e-paper) display microcontroller (S1C17F57) for small segmented display and the new S1D13T03, a timing microcontroller for small active-matrix e-paper display. Read more
Development of World’s First High Precision “Quantum Dot Light Source” Opening way for Ultra High Speed, High Capacity Optical Communication using New Frequency Band
Nanotechnology is considered to be the next technological revolution, expected to provide groundbreaking solutions to the most serious issues that we are faced with. It promises super fast computers, cleaner earth and longer and healthier lives, just to name a few. Based on this novel technology group of Japanese scientists at National Institute of Information and Communication Technology (NICT) have successfully developed world’s first high precision wavelength-tunable “Quantum Dot Light Source”, which was made possible through use of semiconductor quantum dots of nanoscale structure in a new frequency band consisting of wavelengths that are not currently used for optical communication. Read more
Development of World’s First Conductive Silver Ink to form Electronic Circuits by UV Light
TANAKA Kinzoku has announced the development of a special silver ink which can be hardened without heating by applying only Ultraviolet (UV) light to be used for electronic circuits. The new discovery will enable the electronic wiring possible at room-temperature since no heating is required. Hence, by using the newly developed silver ink it is possible to perform wiring not only on glass base material and substrates, but also on flexible base materials such as polyvinyl chloride film (PVC film) as well as polyester film (PET film), which up to now was difficult due to their susceptibility to heat. Read more
Development of Back-Illuminated Stacked Structure CMOS Image Sensor by SONY
Conventional CMOS image sensors have been designed in a way where the mounted pixel section and analog logic circuit are on top of the same chip, which requires overcoming numerous constraints when mounting a large scale circuits. Such constraints as measures to counter the circuit scale and chip size, measure to suppress noise caused by the layout of the pixel and circuit section as well as optimizing the characteristics of pixel and circuit transistors. To overcome these constraints, Sony has developed a back-illuminated COMS image sensor with a structure that layers the pixel section, containing formations of back-illuminated structure pixels over the chip affixed with mounted circuit for signal processing. Through use of this stack structure will make it possible to mount large-scale circuits while keeping the chip size small. Read more
Release of Self-Monitoring Blood Glucose Meter for Diabetes Patients
EIDIA diagnostic subsidiary of Eisai has announced the launch of “LIFE CHECK”, a self-monitoring blood glucose meter manufactured by GUNZE Limited, on January 27th, 2012. LIFE CHECK will help the diabetes patients to monitor their own blood glucose level through simple insertion of a dedicated sensor known as the LIFE CHECK SENSOR into the meter. The LIFE CHECK meter uses a color liquid crystal screen displaying easy to follow step-by-step operational instruction and easy to read graphs of measured data. Read more
Development of Ruthenium-based MOCVD Film formation Material to be used in Next Generation 20 nm DRAM
In joint development with Kyushu University, Tanaka Kinzoku has announced the development of ruthenium based MOCVD (Metalorganic Chemical vapor deposition) film formation material with ability to form a film which is more than 6 times the normal depth for capacitor electrodes currently used in semiconductor memory DRAM ( Dynamic random Access Memory). The new material is expected to be used in next-generation DRAM at 20nm size or less, where it can form a uniform ruthenium film inside fine pores with a high aspect ratio (ratio of the depth and diameter of pores) of 40:1. With overwhelming increase in semiconductor memory capacity, forcing semiconductor manufacturers to adopt to manufacturing methods which deeply carve memory cells, giving capacitor electrodes a 3D structure, where MOCVD film formation is expected to be used as a method for manufacturing 3D electrodes. Read more
