SANYO’s new LSI chip for microphone free earphone
Since 2006 Sanyo has been developing LSI chip for microphone free earphones. The first generation LSI the “LC70700W” has been already used for industrial application. The “LC70700W” was a two chip solution one is the earphone microphone LSI and the other is noise cancellation LSI. For the second generation “LC70701LG” LSI Sanyo managed to combine the two LSI chips into one and at the same time achieving to reduce its overall form factor by 82%. Further to this by implementing original low energy consumption technology, the electric consumption of the digital part has been reduced to 1.1V from it original level of 1.5 V resulting in 25% cut in electric consumption. Through use of this technology by putting the “LC70701LG” equipped earphone in one’s ear it is possible to talk and hear without any needs for a microphone. The earphone is able to pick up the vibration of the voice just like a microphone. This technology was originally developed based on the fact that vocal cords vibrates when human utter or whisper causing a simultaneous sending of a very weak voice signal from the eardrum. The LC70701LG” operates by magnifying this voice signals into spoken words that the recipient can comprehend. Sanyo anticipates the deployment of “LC70701LG” into Bluetooth headsets for mobile phone. SMK Corporation has already made announcement this month of microphone free Bluetooth headset “FX7009” which has been implemented with “LC70701LG” technology. The sample pricing of “LC70701LG” will be at 800 yen and the sample shipment will commence in March 2009.