Development of New Dry Film Photoresists by Shin-Etsu
Shin-Etsu MicroSi a leading Japanese company in development of Organic and Inorganic chemicals, Electronic Materials as well as Functional materials has developed a new dry film photoresists targeted at 3D Through Silicon Vias and 2-dimentional wafer bonding applications. A through-silicon via is a vertical electrical via passing completely through a silicon wafer or die. TSV technology is important in creating 3D packages and 3D integrated circuits. A 3D package contains two or more chips stacked vertically so that they can occupy less space. Read more
Development of new technology capable of converting 2-Dimentional media to 3-Dimentional media by NICT
National Institute of Information and Communications Technology (NICT) has developed “gCubik+i” system capable of picking up an image from a two dimensional media and converting it to a three dimensional image where the image can be manipulated interactively. “gCubik+i” has been developed based on NICT’s “gCubik” system which is a graspable cubic auto stereoscopic display. Although, previously only pre-calculated specific three dimensional images could have been displayed, this time by using newly developed three-dimensional image generating algorithm, “gCubik” is enable to calculate and display the three-dimensional images in real time. Through this development the system is not only capable of displaying different models or moving three dimensional images instantly, it is also capable of interactive operations freely such as rotating and moving models. Read more
JVC‘s new lineup of High-Definition Video Camera Everio
JVC today unveiled its new lineup of high-definition video camera Everio series. The”GZ-HM400″ with double memory SD/SDHC card slot and 32G byte built-in memory. Furthermore, the”GZ-HM400″ is equipped with the industry’s highest “1/2.33 inch 10.29 Megapixel” COMO sensor and Bayer array RGB color filter resulting in full high-definition video recording with 1080 TV lines of Horizontal Resolution which is the maximum number of high-definition standard.The”GZ-HM400″ is capable of shooting real 9 megapixcel (3456 × 2592 dots) still image with no interpolation. Read more
Release of brand new External DVD Players by Buffalo Japan
Buffalo Japan released its latest series of external DVD players namely the DVSM-PS58U2 series and DVSM-PN58U2V series. Both players come with compact and portable design plus they don’t require AC adapter as they are powered through USB 2.0 bus connection via PC. The DVSM-PS58U2 series are the most suitable portable DVD driver for mini-notebooks as well as net-books which do not have built-in CD/DVD drive. Furthermore, the DVSM-PS58U2 series comes with abundant number software such as PowerDVD8, MediaShow4, Power2Go, PowerBackup2 and InstantBackup5. The low-end series DVSM-PN58U2V comes only with DVD/CD writing software such as Power2Go,and InstantBurn. Read more
Development of Static Pressure soldering technology by OKI
As machines in industrial electronic field are becoming faster and highly integrated making the printed wire boards (PWBs) to become larger and multilayered. Additionally with the growing trend in use of lead free soldering making it difficult to assemble machines. For instance, on a PWB with a area of 460 x 500mm and thickness of 4mm there are cases where a mix of over 10,000 surface-mounted components and insertion components must be soldered to it all by using lead-free material. Furthermore, to make this more of a challenge, installing an insertion component requires one to first perform reflow soldering of the surface-mounted components on both sides of the PWB, then insert the component terminal in the PWB’s through-hole, and then perform soldering. In conventional soldering method where soldering irons or flow soldering machine is being used , under filling of the through-hole can occur which is caused due to lack of heat or non-stable solder filling. But applying high degree of heat using soldering iron technique in order to avoid under filling may cause the cutting of internal layer patterns of PWB. Read more
Nissan unveiled its All-Electric Vehicle Platform
Nissan Motor Co., Ltd. showcased its electric vehicle (EV) platform on a Tiida based prototype plus a sophisticated EV-IT system which has been developed by the company in support of 24/7 electric driving life style. The newly developed EV platform is comprised of highly rigid body, high-performance motor, compact lithium-ion battery with high power output and energy capacity. The Nissan in-house developed electric motor features the 80kw/280Nm for high response and powerful acceleration. The 24kWh laminated compact Li-ion battery pack is placed under the vehicle floor allowing a smooth under floor air-flow resulting in reduced drag. Read more
Development of world’s highest light output for Organic EL devices by SDK
Showa Denko KK. (SDK) made an announcement on development of a new structure for company’s coated phosphorescent polymer based Organic Electroluminescent devices capable of achieving around 40% in light output. The new device with the 30 lm/W emissive efficiency is the highest level that has been recorded among coated type organic EL devices in the world. The company is hoping for commercialization of this new structure to be used for general lighting application in the future. Under the production process organic EL devices are classified into two types, deposition type and coated type. Unlike the deposition type which has a multilayer structure and requires vacuum for its production at a high cost, the coated type consists of few layers which is formed by coating polymer without the use of vacuum, providing a substantial cost reduction in its production. Read more
Shipment of first USB 3.0 SATA bridge ICs in the market by FUJITSU
In an ever growing demand from PC and other digital audio visual equipment manufacture to handle the constantly increasing volume of digital data such as digital photos, audio and video files, has forced these manufacturers to move to the latest version of the ubiquitous USB interface namely USB 3.0. The current data transmission rate under the USB 2.0 specification at 480Mbps makes it too slow to meet the current demand in reading and writing high volumes of data in a very short time. Under the USB 3.0 specification which was ratified on November of 2008, the newly interface should promise a data transfer rate of over ten fold in comparison to USB 2.0. Read more
Japan Technology Information Newly opened “Business Opportunity” page
As our continuing effort to bring the latest news from Japan to our audiences across the globe through our partnership with TrendyMix inc. here in Japan we have opened a new channel in both helping companies interested to work with Japanese companies whom their products have been show cased in our blog as well as the companies from overseas that are interested to expand their business in Japan. As a result of this we have opened the Business Opportunity page within our blog helping interested companies to contact us.
Introduction of Two new models to the eneloop Bike Line up by Sanyo
Here are couples of cool looking bikes for all you outdoor enthusiasts. Sanyo in its promotion of its eneloop core product and its grand picture of greener life has introduced two new additions to its eneloop bike lineup, which are electric hybrid bicycles, to be launched in Japan. The CY-SPK227 is a sports-type featuring the world’s first carbon composite frame manufactured with the same technology as used for F1 racing car bodies. Read more
