Development of New Dry Film Photoresists by Shin-Etsu
Shin-Etsu MicroSi a leading Japanese company in development of Organic and Inorganic chemicals, Electronic Materials as well as Functional materials has developed a new dry film photoresists targeted at 3D Through Silicon Vias and 2-dimentional wafer bonding applications. A through-silicon via is a vertical electrical via passing completely through a silicon wafer or die. TSV technology is important in creating 3D packages and 3D integrated circuits. A 3D package contains two or more chips stacked vertically so that they can occupy less space. Among the feature of these newly developed dry films are their low residual stresses resulting in an ultra low modulus which gives the film a rubber like characteristic resulting in minimal wafer bow which is particularly important among the 300mm wafer which are hard to process if the wafers are not flat, low temperature cure, good adhesion and low dielectric constant for superior electrical performance. Shin-Etsu developed the new dry film based on company’s know how on silicon materials, where the company designed the materials to fit specific applications. In regard to TSV the newly developed film can simply be applied through a roll laminator or via vacuum lamination which is a preferred method due to the combination of temperature, pressure and vacuum which allows the material to flow into the vias producing a void free dielectric fill and a planarized surface. The first process that currently utilizes TSV technology is CMOS image sensors. In regard to CMOS image sensors, the newly developed dry film can be applied for bonding applications such as wafer-to-wafer, chip-to-wafer and wafer-to-glass bonding. The two series of this newly dry film namely SINR 3170 and SINR 3570 are now in production level and are available for sampling and evaluation.
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[...] Development of New Dry Film Photoresists by Shin-Etsu | Japan …… pressure and vacuum which allows the material to flow into the vias producing a void free dielectric fill and a planarized surface. The first process that currently utilizes TSV technology is CMOS image sensors. … [...]
[...] of semiconductor technology as well as increase in wiring density use of the conventional polymer photoresists which is the base materials for conventional semiconductor resist will face some difficulties. With [...]