Development of New High-thermal Conductive Silicon Soft pad material by Shin-Etsu Chemical
Shin-Etsu Chemical made an announcement on development of new series of products featuring both high thermal conductivity and excellent insulation properties. The newly developed soft pad silicon product in addition to its high thermal conductivity and softness which provides a good compressibility and stress-relaxation characteristics offers a excellent workability and processibility with low specific gravity. The new product was developed as a countermeasure against the heat emanating from various electronic devices such as the ones are mounted in notebook PCs, LED lighting, hybrid cars and electric cars, it also meets the requirements for thinner and lighter weight device applications. The TC-CA Series heat-dissipating thermal interface materials are thermally conductive compounds which will fit between the heat-generating unit such as computer’s CPU and the heat sink unit. With increasing miniaturization and higher performance of electronic devices, there is an increasing need for a more effective heat-dissipation material. The TC-CA Series has a line up of four different kinds of products namely the TC-CAS, TC-CAB, TC-CAD and TC-CAT which can be used depending on the target applications. Commercial production of the TC-CA Series is scheduled to commence by beginning of Dec. 2009.
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[...] cars with a plan of significantly aloft use inside of a subsequent multiform years or so. Development of New High-thermal Conductive Silicon Soft pad material by Shin-Etsu Chemical – japantechniche.com 10/15/2009 Shin-Etsu Chemical made an announcement on development of new [...]