ROHM unveils Industry’s First Compact High-Speed Optical Communication Module
Improved display resolution and camera picture quality as well as capability of video playback on today’s mobile phones making inter-substrate transmission rate among the mobile phone manufacturer an increasingly important characteristic. But the current thin coaxial lines or flexible cables made of copper wiring can handle only about 500Mbps due to various effects such as attenuation and fluctuation from bending. In addition to this shortcoming the copper wiring requires between 40 to 50 wires making it the resulting cable difficult to bend which is an important issue during the assembly. Finally, the connector and cable footprints are large resulting in noise generation or its susceptibility to noise. In order to overcome this, Rohm has developed the industry’s first ultra compact high speed inter-substrate optical communication module capable of transmission rate of 2.5Gbps within portable devices such as mobile phones.
The newly developed module integrates a communication IC (processing), a laser diode (transmission) as well as a photodiode (reception) all in a compact factor of 11.0mm x 3.25mm x 1.0mm, requiring only half the mounting area in comparison to the conventional products. The optical communication has been achieved with a low power consumption of 30mW by way of inter-device transmission using an inexpensive single-core plastic fiber resulting in a larger data transmission capability using only 1/10 of the required wiring plus it completely eliminates EMI noise. The newly developed module will available for sample shipment and OEM quantities by 2010. No pricing has been set for this device as of yet by the company.
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[...] is high, limiting them to be only utilized as high output lasers. In response to this limitation, Rohm has succeeded in developing a highly reliable 2-wavelength laser targeted for low output [...]