Development of Laser assisted Ink-Jet Technology for Fine Wiring by AIST
With ever increasing product specification plus the decreasing product cycles in electronic device manufacturing require on-demand design and production technology capable of high-mix low-volume production as well as cost reduction. Significant part of the device cost is due to the assembly process which occurs when electronic devices are built into the final products with at most precision without causing any damage to the device characteristics. In addition to this, the current semiconductor micro-processing technology is becoming increasing difficult to apply to such large area devices such as flat panel displays due to high cost of vacuum processes.
Due to these factors there has been an expectation for new printed electronics technology that utilizes ink-jet printing capable of producing wires a t atmospheric pressure without masks. But the narrowest achievable line width with current ink-jet technologies remains at roughly 0.03-0.05mnd in regard to yield the viscosity of ink must be controlled in order to reduce the ejected ink droplet size. Furthermore, there are also serious issues with fine pattern wires where wire become too thin since ink droplets tends to spread and droplets themselves are too small especially in the area of conductor wiring which requires repeated reprinting in order to obtain interconnection resistance resulting in decrease in product efficiency. Based on these needs, AIST (advance Industrial Science and Technology ) in Japan has developed a laser assisted ink-jet technology for high speed printing of fine wiring capable of low-resistance wiring on various types of substrates. The wire which is only 10000 nm in line width is produced by LIU technology. This line has a resistance per unit length of as low as 6 ohm per cm due to the high aspect ration resulting in a significant improvement over the existing industrial ink-jet printing technologies using ultrafine metal particle ink where the interconnection resistance would be 70 ohm/cm for a line with 10000nm width. By way of this technology, low-resistance wires can be printed at high speed for interposers between chips and a main board, wiring on on flexible resin members, step connections between metal parts as well as high-density wiring on curved surfaces. The new technology is a great promise in improving the efficiency of development and production of microelectronic devices.
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