Development of Industry’s Highest Capacity Embedded NAND Flash Memory Modules by TOSHIBA
Toshiba made an announcement on development and launch of a 64 gigabyte (GB) embedded NAND flash memory module, the highest capacity in the industry. The chip is in full compliance with e-MMC(TM) standard, targeted for various digital consumer products such as smart phones, mobile phones, netbooks and digital video cameras. The new chip combines sixteen 32Gbit (equal to 4GB) NAND chips and dedicated controller thanks to Toshiba’s 32nm process technology which includes application of chip thinning and layering technologies in achieving a thickness of only 30 micrometers for each individual chip. Toshiba is the first company in succeeding to combine 16 NAND chips. Furthermore, the device is within full compliance of JEDEC/MMCA Ver. 4.4 standard for embedded multimedia cards supporting standard interfacing and simplified embedding in products resulting in reduced development cycle on product manufacturers. The new development is a response to growing demand for embedded memories with embedded controller functionality minimizing development cycle and at the same time provide an easy integration into system design. The mass production of this new device will commence in the first quarter of 2010. The samples of 64GB modules are available immediately.
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[...] made an announcement on expanding its lineup of NAND flash based SSD (Solid State Drives) manufactured based on Toshiba’s 32nm Multi-Level-Cell NAND [...]