Development of New Technology for Embedding High-Performance IC Chip by DNP
Dai Nippon Printing (DNP) has successfully developed a technology for manufacturing world’s first Printed Wiring Boards (PWB) with embedded wire-bonded high performance IC chip. The newly developed PWBs contain approximately 40-pin components which are mounted using soldering.Through use of this technology, it is possible to embed over 700-pin components, in addition of meeting a lower profile and higher density. DNP’s newly developed build-up PWB manufacturing technology provides a convenient way of downsizing and higher density with a three dimensional structure, composing of IC chips and passive components mounted both inside and on a PWB. Furthermore, it is also possible to arrange the electrical connections between the layers. Mass production of newly developed PWB will begin from October of 2010, with an aim of 4 billion in sale by March of 2012.