Launch of a New Transfer Molded Power Module for Hybrid and EV Application by Mitsubishi Electric
Mitsubishi Electric has announced the launch of a new transfer molded power module (T-PM) that is mainly designed for hybrid and electric vehicle applications. Transfer molding is a pressure molding method where heated and pressurized resin is poured into a metal mold and enclosed, enabling manufacturer to make multiple molds simultaneously.
The new J-Series T-PM features an enhanced reliability by incorporating inner connection technology which is referred to as direct lead bonding (DLB), responsible for reducing power loss by way of decreasing wiring resistance and inductance in module through an extended main terminal which is sufficiently long to be bonded directly to the power chip. Previous to this the power chips were connected to terminals by aluminum wire. The new 600V/300A power module incorporates two carrier-stored trench gate bipolar transistor (CSTBT) IGBT chips. The T-PM is completely lead free, including the terminal plating.