Development of Semiconductor Marking System Based on Inkjet Printing Method
Seiko Epson has announced the release and sale of new semiconductor marking system which works based on inkjet printing system. The system will be used to print identification data, such as manufacturer’s name or a production number, on the surface of a semiconductor package. This fast printing method will protect the IC chip inside, contrary to conventional method which uses engraving using laser cutter. The new method is ideal dealing with marking the smaller and thinner semiconductor without any risk of damaging the IC chip inside the package. The new IP-2000 is based on Epson’s proprietary Micro Piezo technology where it prints directly onto semiconductor packages by applying high-visibility white UV cured ink which is also developed by Epson.
The new system does not require any printing plates, making the IP-2000 ideal for small lot manufacturing for a wide variety of products. The IP-200 strengthens the adhesion between the ink and the package surface by performing a clean action prior to applying the ink. At the same time applying the ultraviolet irradiation during the printing process would solidify the ink.