Industry’s First 12-Inch Wafer Bonding Machine with Capability of making 3D Integrated LSI Circuits
Mitsubishi Heavy Industry has announced the development of world’s first fully automated 12-inch wafer bonding machine capable of making 3D integrated LSI circuit at room temperature. The newly developed “Bond Meister MWB-12-ST” operates based on fast atom beam (FAB) gun that irradiate atoms for activating a material surface to bond. The FAB offers 20 times greater energy per particle than an ion gun capable of effectively removing oxide film from the surface of the bonding metal material which normally prevents bonding. The new equipment is capable of continuous bonding of up to five 12-inch wafers plus it can perform wafer transfer and alignment for automatic bonding.
Furthermore, the “Bond Meister MWB-12-ST” can be set to accommodate bonding conditions for individual wafer allowing production of various types in small batches. The capability of “Bond Meister MWB-12-ST” in performing bonding at room temperature for different types of materials such as silicon and metals would eliminate the heating process, freeing devices from heat stress, allowing rigid and highly reliable bonding while reducing processing time by eliminating any needs for a heating/cooling cycle, resulting in significantly shorter production time and a higher yield ratio, thus resulting in reduction in device overall production costs.
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