Development of Low-Power Wireless LSI with World’s Fastest Data Transfer Rate
Sony and Tokyo Institute of Technology have jointly developed a radio frequency (RF) LSI and a baseband (BB) LSI based on millimeter-wave wireless data transfer capable of data transfer rate of 6.3 Gb/s, world’s fastest. In this joint development Sony’s contribution was in designing the digital parts of the BB LSI as well as the development of the chip unit as a whole, while the Tokyo Institute of Technology contribution was in designing the RF LSI and the analog parts of the BB LSI. Sony is effort in high-efficiency and high-integrity of the rate-14/15 Low-Density Parity-Check (LDPC) error-correcting code has resulted in decreased amount of redundant data required for error correction, which enabled LDPC decoding at the world’s lowest per-bit energy efficiency of 11.8 pJ/b (74 mW at 6.3 Gb/s).
Further, a research team led by Professor Akira Matsuzawa and Associate Professor Kenichi Okada at the Tokyo Institute of Technology has developed an RF LSI that functions as a 60 GHz band millimeter-wave direct-conversion transceiver capable of 16 Quadrant Amplitude Modulation (16QAM) of high-speed wireless communication for every frequency channel defined under the 60 GHz band millimeter-wave wireless communication standard. This was achieved through unique back-to-back layout structure of the injection locked oscillator. Furthermore, the analog-to-digital converter (ADC) on the BB LSI achieved the world’s lowest power consumption of 12mW at a sampling rate of 2.3 G samples/s as an ADC integrated in a 60 GHz wireless chip through development of a simple comparator that does not increase the conversion noise.
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