Development of Ultra-High Speed Processing Technology for Micro Hole Drilling Processing for Ultra-Thin Glass
Asahi Glass Co. (AGC) has announced the development of micro drilling process technology for ultra-thin glass with a thickness of 0.1 mm. This new technology in conjunction with production technology for ultra-thin glass can open the door for use of glass in such applications such as laminated semiconductors.
Laminated semiconductors are made by means of vertically stacking semiconductor chips for improved performance, where it is connected to a printed circuit board via an interposer. The imposer requires many holes with a diameter of about 50 micrometer to connect through-electrodes of semiconductors. With currently available technology it has been difficult to drill micro holes in ultra-thin glass, but by applying the newly developed micro hole drilling processing technology, AGC will be able to drill holes precisely with high speed into the connect through-electrodes.