Development of Low-Melting Glass to be used as Low Temperature Sealant
Hitachi and Hitachi Chemical have jointly developed a 220-300 degrees Celsius, low-melting temperature glass (“low-melting glass”). The glass has been developed as a low temperature sealant which does not contain regulated materials such as lead or halogens such as fluorine or iodine. The new product is relatively inexpensive in comparison to gold-tin solder, a conventional low-temperature sealant, while providing better sealant properties than adhesive resins against air and moisture.
The material can be used with metals, ceramics and resins, as well as melted with a variety of heat sources such as hot plates, infra-red lamps, laser, etc.