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<channel>
	<title>Japan Technology Information</title>
	<atom:link href="http://japantechniche.com/feed/" rel="self" type="application/rss+xml" />
	<link>http://japantechniche.com</link>
	<description>Japan Technology Information will bring you the most recent technological information from Japan</description>
	<lastBuildDate>Fri, 19 Mar 2010 07:00:21 +0000</lastBuildDate>
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		<title>Hamamatsu Photonics Unveils a CMOS based High-Sensitivity Digital Camera</title>
		<link>http://japantechniche.com/2010/03/19/hamamatsu-photonics-unveils-a-cmos-based-high-sensitivity-digital-camera/</link>
		<comments>http://japantechniche.com/2010/03/19/hamamatsu-photonics-unveils-a-cmos-based-high-sensitivity-digital-camera/#comments</comments>
		<pubDate>Fri, 19 Mar 2010 07:00:21 +0000</pubDate>
		<dc:creator>sia</dc:creator>
				<category><![CDATA[Trendy Products]]></category>
		<category><![CDATA[Analytica 2010 in]]></category>
		<category><![CDATA[CMOS based]]></category>
		<category><![CDATA[CMOS image sensor]]></category>
		<category><![CDATA[digital camera]]></category>
		<category><![CDATA[Germany]]></category>
		<category><![CDATA[HAMAMATSU Photonics]]></category>
		<category><![CDATA[High-Sensitivity]]></category>
		<category><![CDATA[japan]]></category>
		<category><![CDATA[Munich]]></category>
		<category><![CDATA[ORCA-Flash 2.8]]></category>
		<category><![CDATA[Unveils]]></category>

		<guid isPermaLink="false">http://japantechniche.com/?p=5160</guid>
		<description><![CDATA[Hamamatsu Photonics Unveils a CMOS based High-Sensitivity Digital Camera]]></description>
			<content:encoded><![CDATA[<p><img src="http://japantechniche.com/wp-content/uploads/2010/03/Hamamatsu-CMOS-based-digital-camera.jpg" alt="Hamamatsu CMOS based digital camera" title="Hamamatsu CMOS based digital camera" width="270" height="180" class="alignleft size-full wp-image-5163" />Hamamatsu Photonics has made an announcement on development of ORCA-Flash 2.8, the company’s first high sensitivity digital <a href="http://japantechniche.com/2010/01/05/development-of-dual-ccd-camera-with-interchangeable-optical-blocks-by-hamamatsu-photonics/">camera</a> which has been developed based on CMOS image sensor technology. The newly developed ORCA-Flash 2.8, has been designed for low-light imaging application, offers its users a cost effective way in capturing high resolution images at high frame rates and low noise. <span id="more-5160"></span><br />
The new ORCA-Flash 2.8, is ideal for a wide range of scientific imaging applications such as semiconductor inspection as well as industrial imaging. The ORCA-Flash 2.8 will be exhibited during the Analytica 2010 in Munich, Germany form March 23 to 26. Hamamatsu shall begin receiving orders from Japan as well as international based clients form April.<br />
<a href="http://jp.hamamatsu.com/hamamatsu/press/2010/2010_03_16.html">source</a><br />
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		<item>
		<title>Development of New Technology for Embedding High-Performance IC Chip by DNP</title>
		<link>http://japantechniche.com/2010/03/18/development-of-new-technology-for-embedding-high-performance-ic-chip-by-dnp/</link>
		<comments>http://japantechniche.com/2010/03/18/development-of-new-technology-for-embedding-high-performance-ic-chip-by-dnp/#comments</comments>
		<pubDate>Thu, 18 Mar 2010 08:51:06 +0000</pubDate>
		<dc:creator>sia</dc:creator>
				<category><![CDATA[Trendy Products]]></category>
		<category><![CDATA[Dai Nippon Printing]]></category>
		<category><![CDATA[Development of]]></category>
		<category><![CDATA[DNP]]></category>
		<category><![CDATA[Embedding]]></category>
		<category><![CDATA[High performance]]></category>
		<category><![CDATA[higher density]]></category>
		<category><![CDATA[IC Chip]]></category>
		<category><![CDATA[lower profile]]></category>
		<category><![CDATA[New technology]]></category>
		<category><![CDATA[Printed Wiring Board]]></category>

		<guid isPermaLink="false">http://japantechniche.com/?p=5152</guid>
		<description><![CDATA[Development of New Technology for Embedding High-Performance IC Chip by DNP]]></description>
			<content:encoded><![CDATA[<p><img src="http://japantechniche.com/wp-content/uploads/2010/03/DNP-new-PWB-2-300x255.jpg" alt="DNP new PWB 2" title="DNP new PWB 2" width="300" height="255" class="alignleft size-medium wp-image-5153" />Dai Nippon Printing (DNP) has successfully developed a technology for manufacturing world’s first <a href="http://japantechniche.com/2010/03/09/development-of-the-world%E2%80%99s-slimmest-printed-wiring-board-with-embedded-ic-chips-and-passive-components-by-dnp/">Printed Wiring Boards (PWB)</a> with embedded wire-bonded high performance IC chip. The newly developed PWBs contain approximately 40-pin components which are mounted using soldering.Through use of this technology, it is possible to embed over 700-pin components, in addition of meeting a lower profile and higher density.<span id="more-5152"></span> DNP&#8217;s newly developed build-up PWB manufacturing technology provides a convenient way of downsizing and higher density with a three dimensional structure, composing of IC chips and passive components mounted both inside and on a PWB. Furthermore, it is also possible to arrange the electrical connections between the layers. Mass production of newly developed PWB will begin from October of 2010, with an aim of 4 billion in sale by March of 2012.<br />
<a href="http://www.dnp.co.jp/news/1211651_2482.html">source</a><br />
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		</item>
		<item>
		<title>World’s Smallest 25V Monolithic Ceramic Capacitor by MURATA Manufacturing</title>
		<link>http://japantechniche.com/2010/03/18/world%e2%80%99s-smallest-25v-monolithic-ceramic-capacitor-by-murata-manufacturing/</link>
		<comments>http://japantechniche.com/2010/03/18/world%e2%80%99s-smallest-25v-monolithic-ceramic-capacitor-by-murata-manufacturing/#comments</comments>
		<pubDate>Thu, 18 Mar 2010 07:08:32 +0000</pubDate>
		<dc:creator>sia</dc:creator>
				<category><![CDATA[Green Tech]]></category>
		<category><![CDATA[25V]]></category>
		<category><![CDATA[Capacitor]]></category>
		<category><![CDATA[LCD TV]]></category>
		<category><![CDATA[LED backlight]]></category>
		<category><![CDATA[Monolithic Ceramic]]></category>
		<category><![CDATA[MURATA Manufacturing]]></category>
		<category><![CDATA[notebook PCs]]></category>
		<category><![CDATA[world’s smallest]]></category>

		<guid isPermaLink="false">http://japantechniche.com/?p=5143</guid>
		<description><![CDATA[World’s Smallest 25V Monolithic Ceramic Capacitor by MURATA Manufacturing]]></description>
			<content:encoded><![CDATA[<p><img src="http://japantechniche.com/wp-content/uploads/2010/03/Murata-25V-capacitor-300x193.jpg" alt="Murata 25V capacitor" title="Murata 25V capacitor" width="300" height="193" class="alignleft size-medium wp-image-5144" />Miniaturization of notebook PCs , LCD TVs as well as mobile phones, along with their power hungry applications has increased a demand for small and high capacity monolithic ceramic capacitors for LED backlight of LCD TVs and mobile phone displays. <span id="more-5143"></span><br />
Based on this need, Murata manufacturing with its continued effort in this area has developed as company claims the world’s tinniest 25V rating <a href="http://japantechniche.com/2009/10/30/super-tiny-monolithic-ceramic-capacitor-by-murata/#more-3593">monolithic ceramic capacitor</a>. The newly developed capacitor features a dimension of 1.6&#215;0.8mm (10uF). The new model is a 60% reduction in size in comparison to Murata’s previous model. Furthermore, its capacitance has been improved by 10 times at a same size, rated voltage and temperature characteristics. The production of this product will commence on April 2010, with a sample price of 20JPY per unit.<br />
<a href="http://www.murata.co.jp/new/news_release/2010/0218/index.html">source</a><br />
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Development of HiFi Sound Processors for Automobile Audio System by ROHM</title>
		<link>http://japantechniche.com/2010/03/17/development-of-hifi-sound-processors-for-automobile-audio-system-by-rohm/</link>
		<comments>http://japantechniche.com/2010/03/17/development-of-hifi-sound-processors-for-automobile-audio-system-by-rohm/#comments</comments>
		<pubDate>Wed, 17 Mar 2010 09:45:42 +0000</pubDate>
		<dc:creator>sia</dc:creator>
				<category><![CDATA[Trendy Products]]></category>
		<category><![CDATA[advanced switching technology]]></category>
		<category><![CDATA[Automobile Audio System]]></category>
		<category><![CDATA[BD375 ** series]]></category>
		<category><![CDATA[Development of]]></category>
		<category><![CDATA[HiFi]]></category>
		<category><![CDATA[input gain adjustment]]></category>
		<category><![CDATA[loudness switching]]></category>
		<category><![CDATA[parametric-type loudness]]></category>
		<category><![CDATA[Rohm]]></category>
		<category><![CDATA[Sound Processors]]></category>
		<category><![CDATA[tone control]]></category>

		<guid isPermaLink="false">http://japantechniche.com/?p=5116</guid>
		<description><![CDATA[Development of HiFi Sound Processors for Automobile Audio System by ROHM]]></description>
			<content:encoded><![CDATA[<p><img src="http://japantechniche.com/wp-content/uploads/2010/03/Rohm-Sound-processors.jpg" alt="Rohm Sound processors" title="Rohm Sound processors" width="250" height="199" class="alignleft size-full wp-image-5117" />Rohm has developed High Fidelity sound processors for car audio system. The newly developed BD375 ** series is a 18 models and all with different input/output channels as well as tuning functions, designed to be compatible with different <a href="http://japantechniche.com/2009/09/15/development-of-usb-host-audio-decoder-ics-by-rohm/">audio </a>sources, cabin interiors, entertainment systems, and customer preferences. The new processors comes with Rohm’s advanced switching technology capable of eliminating instantaneous disconnections causing shock noise, which occurs during adjustment, smoothing out the signal waveform during the period of adjustment resulting in virtually no shock noise. <span id="more-5116"></span><br />
<img src="http://japantechniche.com/wp-content/uploads/2010/03/Rohm-Sound-processors2-300x141.jpg" alt="Rohm Sound processors2" title="Rohm Sound processors2" width="300" height="141" class="alignleft size-medium wp-image-5118" />The applied switching technology does not only take care of the noise during volume adjustment but also for input gain adjustment, tone control, as well as loudness switching. The new sound processor features a ultra-low loss and distortion required for high fidelity audio reproduction in automotive systems, which has been realized through development of high performance elements circuitry. Furthermore, the new processor features, an integrated 2-/3-band parametric equalizer, enabling the target frequency (fo), equalizer gain and Q Curve to be controlled via microcontroller without any needs for external parts or modifications. Finally, Rohm has developed a parametric-type loudness function for low-end (bass) correction compatible with vehicles of all types.<br />
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Development of a New Method in Transmitting Electrical Signals Via Insulators</title>
		<link>http://japantechniche.com/2010/03/17/development-of-a-new-method-in-transmitting-electrical-signals-via-insulators/</link>
		<comments>http://japantechniche.com/2010/03/17/development-of-a-new-method-in-transmitting-electrical-signals-via-insulators/#comments</comments>
		<pubDate>Wed, 17 Mar 2010 04:34:49 +0000</pubDate>
		<dc:creator>sia</dc:creator>
				<category><![CDATA[Green Tech]]></category>
		<category><![CDATA[Development of a New Method . Transmitting Electrical Signals. Insulators .Tohoku University.Professor Eiji Saitoh.Magnetic Garnet Crystal]]></category>
		<category><![CDATA[energy loss]]></category>
		<category><![CDATA[energy saving]]></category>
		<category><![CDATA[japan]]></category>
		<category><![CDATA[spin waves]]></category>

		<guid isPermaLink="false">http://japantechniche.com/?p=5136</guid>
		<description><![CDATA[Development of a New Method in Transmitting Electrical Signals Via Insulators ]]></description>
			<content:encoded><![CDATA[<p>Years ago during one of my trips to US;I had a chance to discuss a theory of boosting/regenerating optical signals via the optical cables sheath with a professor from Michigan University who happen to sit next to me. An idea, that would have saved millions of dollars in equipment cost mainly cost of Regeneration equipments, then used, to boost optical signals in long haul network architecture. Well, today I had read a news that a group of researchers led by Professor Eiji Saitoh at Institute for Materials Research at Tohoku University in JAPAN has succeeded in developing a method, capable of transmitting electrical signals through its insulators using electron spin technology.<span id="more-5136"></span><br />
The insulators are not capable of transmitting <a href="http://japantechniche.com/2009/10/16/development-of-wireless-power-transfer-technology-by-sony/">electrical signals</a>, however, through application of this technology; the electrical signals are converted into spin waves, where later on they are injected into insulators. The spin injection which is called Magnetic Garnet Crystal is converted back to electrical signals. The new research was an answer to overcome the energy loss that normally occurs when the electrical current is being transmitted in metals or insulators generating Joule heat. The newly developed technology will pave the way for a new energy-saving method for information transmission. Pretty Amazing, isn&#8217;t it.<br />
<a href="http://www.tohoku.ac.jp/japanese/2010/03/press20100311-01.html">Source </a><br />
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		<item>
		<title>Development of World’s Smallest and Thinnest Surface Mount Pyroelectric Infrared Sensor by MURATA Manufacturing</title>
		<link>http://japantechniche.com/2010/03/16/development-of-world%e2%80%99s-smallest-and-thinnest-surface-mount-pyroelectric-infrared-sensor-by-murata-manufacturing/</link>
		<comments>http://japantechniche.com/2010/03/16/development-of-world%e2%80%99s-smallest-and-thinnest-surface-mount-pyroelectric-infrared-sensor-by-murata-manufacturing/#comments</comments>
		<pubDate>Tue, 16 Mar 2010 04:52:14 +0000</pubDate>
		<dc:creator>sia</dc:creator>
				<category><![CDATA[Trendy Products]]></category>
		<category><![CDATA[10% thinner]]></category>
		<category><![CDATA[50% smaller in volume]]></category>
		<category><![CDATA[Air-conditioning units]]></category>
		<category><![CDATA[automatic hot water flushing toilet seat]]></category>
		<category><![CDATA[automatic switches for lighting systems]]></category>
		<category><![CDATA[Development of]]></category>
		<category><![CDATA[digital photo frames]]></category>
		<category><![CDATA[Eco-friendly applications]]></category>
		<category><![CDATA[IRS-B series]]></category>
		<category><![CDATA[MURATA Manufacturing]]></category>
		<category><![CDATA[PCs]]></category>
		<category><![CDATA[Pyroelectric Infrared Sensor]]></category>
		<category><![CDATA[reflow surface mount type]]></category>
		<category><![CDATA[security equipment]]></category>
		<category><![CDATA[Surface Mount]]></category>
		<category><![CDATA[thinnest]]></category>
		<category><![CDATA[TVs]]></category>
		<category><![CDATA[webcams (IP cameras)]]></category>
		<category><![CDATA[world’s smallest]]></category>

		<guid isPermaLink="false">http://japantechniche.com/?p=5100</guid>
		<description><![CDATA[Development of World’s Smallest and Thinnest Surface Mount Pyroelectric Infrared Sensor by MURATA Manufacturing]]></description>
			<content:encoded><![CDATA[<p><img src="http://japantechniche.com/wp-content/uploads/2010/03/Murata-surface-mount-infrared-sensor-300x192.jpg" alt="Murata surface mount infrared sensor" title="Murata surface mount infrared sensor" width="300" height="192" class="alignleft size-medium wp-image-5101" /><a href="http://japantechniche.com/2009/11/02/development-of-high-precision-temperature-sensing-device-by-murata/">Murata Manufacturing</a> made an announcement on development of world’s smallest and thinnest (4.7&#215;4.7&#215;2.4mm) surface mount pyroelectric infrared sensor, “IRS-B series”. The newly developed infrared sensor was response to mass production and cost reduction of reflow surface mount type sensors. Furthermore, it will pave the way for introduction of the human presence sensor for consumer equipment, while contributing in overall reduction of equipment size. <span id="more-5100"></span><br />
Murata’s development of surface mount type sensor technology was fueled by increasing market demand for human presence sensing in various applications such as energy conservation, theft prevention, appliances and care-giving that bears a smaller form factor for easy and automatic surface mounting, with reduced production cost. IRS-B series is approximately 50% smaller in volume and 10% thinner than company’s previous surface mount model. Furthermore, compared with common lead-type models, it is significantly smaller, offering a lower profile which is approximately 20% less in volume and 50% less in thickness that the previous products. Murata has also developed a extremely flat curvature of the “flat lens” along with “IRS-B series”, contributing to streamline the equipment design. Among some of the application for this newly developed sensors are; TVs, Air-conditioning units, digital photo frames, PCs, automatic switches for lighting systems, webcams (IP cameras), automatic hot water flushing toilet seat, security equipment, Eco-friendly applications to name a few. The new sensor’s operating temperature is from -40 to 70 degrees Celsius and storage temperature ranging from -40 to 85 degrees Celsius. The sale of new sensor has already begun with monthly production of 1 million units at a price tag of 200 JPY per unit.<br />
<a href="http://www.murata.co.jp/new/news_release/2010/0226/index.html"target="_blank">source</a><br />
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		</item>
		<item>
		<title>Development of Multi-Camera Analog Interface IC for Automobile Application by EPSON</title>
		<link>http://japantechniche.com/2010/03/16/development-of-multi-camera-analog-interface-ic-for-automobile-application-by-epson/</link>
		<comments>http://japantechniche.com/2010/03/16/development-of-multi-camera-analog-interface-ic-for-automobile-application-by-epson/#comments</comments>
		<pubDate>Tue, 16 Mar 2010 04:16:16 +0000</pubDate>
		<dc:creator>sia</dc:creator>
				<category><![CDATA[Trendy Products]]></category>
		<category><![CDATA[Analog Interface]]></category>
		<category><![CDATA[Automobile Application]]></category>
		<category><![CDATA[Development of]]></category>
		<category><![CDATA[eliminate blind spot]]></category>
		<category><![CDATA[Epson]]></category>
		<category><![CDATA[higher level of driving safety]]></category>
		<category><![CDATA[IC]]></category>
		<category><![CDATA[Multi-Camera]]></category>
		<category><![CDATA[navigation systems]]></category>
		<category><![CDATA[NTSC/PAL decoders]]></category>
		<category><![CDATA[S2D13P04]]></category>
		<category><![CDATA[security systems]]></category>
		<category><![CDATA[Seiko]]></category>

		<guid isPermaLink="false">http://japantechniche.com/?p=5127</guid>
		<description><![CDATA[Development of Multi-Camera Analog Interface IC for Automobile Application by EPSON]]></description>
			<content:encoded><![CDATA[<p><img src="http://japantechniche.com/wp-content/uploads/2010/03/Epson-Multi-camera-IC.jpg" alt="Epson Multi-camera IC" title="Epson Multi-camera IC" width="125" height="125" class="alignleft size-full wp-image-5128" />Seiko Epson Corporation made an announcement today on development of new four-channel <a href="http://japantechniche.com/2009/09/16/development-of-high-speed-usb-hub-controller-for-automotive-application-by-epson/">car</a> camera interface IC ,capable of combining images from multiple sides of the vehicle, helping to eliminate blind spot, resulting in higher level of driving safety, according to the company. The newly developed S2D13P04 is equipped with four NTSC/PAL decoders, allowing it to connect to up to four analog <a href="http://japantechniche.com/2008/11/18/fujitsu%E2%80%99s-world-first-video-processing-technology-for-vehicles/">cameras </a>and concurrently decode the four video channels. <span id="more-5127"></span><br />
<img src="http://japantechniche.com/wp-content/uploads/2010/03/Epson-Multi-camera-IC2-300x161.jpg" alt="Epson Multi-camera IC2" title="Epson Multi-camera IC2" width="300" height="161" class="alignleft size-medium wp-image-5129" />Furthermore, images from each camera are synchronized to output a digital signal with a stable frame rate in order to reduce the total number of necessary system components. Among some of the key feature on this newly developed IC is its image processing capability by providing composite images, distortion correction, and interlaced/progressive conversion. The S2D13P04 main target applications are multi-camera image displays for car navigation systems and security systems.<br />
<a href="http://www.epson.jp/osirase/2010/100316.htm"target="_blank">source</a></p>
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		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>A New Rolling process for Manufacture of AZ31 Magnesium Alloy by AIST</title>
		<link>http://japantechniche.com/2010/03/15/a-new-rolling-process-for-manufacture-of-az31-magnesium-alloy-by-aist/</link>
		<comments>http://japantechniche.com/2010/03/15/a-new-rolling-process-for-manufacture-of-az31-magnesium-alloy-by-aist/#comments</comments>
		<pubDate>Mon, 15 Mar 2010 05:56:19 +0000</pubDate>
		<dc:creator>sia</dc:creator>
				<category><![CDATA[Trendy Products]]></category>
		<category><![CDATA[AIST]]></category>
		<category><![CDATA[Magnesium Alloy]]></category>
		<category><![CDATA[Manufacture of AZ31]]></category>
		<category><![CDATA[New Rolling process]]></category>

		<guid isPermaLink="false">http://japantechniche.com/?p=5109</guid>
		<description><![CDATA[A New Rolling process for Manufacture of AZ31 Magnesium Alloy by AIST]]></description>
			<content:encoded><![CDATA[<p><img src="http://japantechniche.com/wp-content/uploads/2010/03/AIST-magnesium-alloy-sheet.jpg" alt="AIST magnesium alloy sheet" title="AIST magnesium alloy sheet" width="300" height="225" class="alignleft size-full wp-image-5110" /><a href="http://japantechniche.com/2010/01/20/development-of-new-az91-magnesium-alloy-sheet-by-sumitomo-electric-industries/">Magnesium alloys</a> are inherently light weight structural materials, all due to their high specific strength, high specific stiffness, and not to forget their abundance of resources. Their utilization is expanding into areas of automobiles and consumer electronics industries such as laptop PC and mobile phones, however, rolled magnesium alloy sheets exhibit poor room temperature formability, forcing the press-forming process to be carried out at an elevated temperature above 250 degrees Celsius, where installation of additional equipment for heating the magnesium sheet and dies are required, resulting in significant cost increase in manufacturing. In response to lowering manufacturing cost of magnesium alloy sheet, <a href="http://japantechniche.com/2009/09/01/development-of-new-coloring-technology-by-aist/">AIST</a> (Advanced Industrial Science and Technology) in Japan has developed a new rolling process for commercial magnesium alloy sheet with high room temperature formability.<span id="more-5109"></span><br />
The new rolling process is characterized by high rolling temperature of about 100 degrees higher than that of a conventional rolling process (below 400 degrees Celsius). The magnesium sheet that has been manufactured using the new rolling process shows a significant weak crystal orientation, resulting in excellent room temperature formability comparable to those of aluminum alloy sheets. This will contribute to significant cost reduction, due to the fact that a conventional press-forming machine without using heating equipment can be used to press the new magnesium alloy sheets. Furthermore, since the composition of the new magnesium alloy sheet is the same as the commercial magnesium alloy sheet, conventional surface treatment and joining processes can be applied. AIST currently conducting studies on practical use of the new magnesium alloy sheet, aiming at its wider range of applications.<br />
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		<title>Development of Ultra-Thin Fluid Conveyance Pump for Fuel Cells by MURATA</title>
		<link>http://japantechniche.com/2010/03/15/development-of-ultra-thin-fluid-conveyance-pump-for-fuel-cells-by-murata/</link>
		<comments>http://japantechniche.com/2010/03/15/development-of-ultra-thin-fluid-conveyance-pump-for-fuel-cells-by-murata/#comments</comments>
		<pubDate>Mon, 15 Mar 2010 04:03:09 +0000</pubDate>
		<dc:creator>sia</dc:creator>
				<category><![CDATA[Green Tech]]></category>
		<category><![CDATA[Trendy Products]]></category>
		<category><![CDATA[90% less power]]></category>
		<category><![CDATA[Development of]]></category>
		<category><![CDATA[Direct Methanol fuel Cell]]></category>
		<category><![CDATA[DMFC]]></category>
		<category><![CDATA[Fluid Conveyance Pump]]></category>
		<category><![CDATA[Fuel Cells]]></category>
		<category><![CDATA[low power consumption]]></category>
		<category><![CDATA[Micro-pump MZP Series]]></category>
		<category><![CDATA[mobile equipment]]></category>
		<category><![CDATA[Murata]]></category>
		<category><![CDATA[ultra thin]]></category>

		<guid isPermaLink="false">http://japantechniche.com/?p=5091</guid>
		<description><![CDATA[Development of Ultra-Thin Fluid Conveyance Pump for Fuel Cells by MURATA]]></description>
			<content:encoded><![CDATA[<p><img src="http://japantechniche.com/wp-content/uploads/2010/03/Murata-Micro-Pump-300x193.jpg" alt="Murata Micro Pump" title="Murata Micro Pump" width="300" height="193" class="alignleft size-medium wp-image-5092" />Miniaturization of mobile equipment, created a demand for even smaller batteries with higher capacities, where <a href="http://japantechniche.com/2009/12/25/development-of-direct-methanol-fuel-cell-system-by-panasonic/">direct-methanol fuel cell (DMFC)</a> is expected to satisfy this need, however, up to now, peripheral circuits miniaturization, including pumps and decreasing power consumption has hampered its commercialization. To overcome these obstacles, Murata Manufacturing has developed an ultra-thin fluid conveyance device, “Micro-pump MZP Series” capable of being used in fuel cells for mobile equipment such as mobile phones and laptop computers.<span id="more-5091"></span><br />
In developing the “Micro-pump MZP Series”, Murata has applied the piezoelectric ceramic principle, where a vibration is generated when current is applied. This had lead to commercialization of small form factor (24&#215;33x1.325mm) micro-pump with low power consumption (90% less power than conventional pumps) for mobile equipment’s fuel cells.<br />
<a href="http://www.murata.co.jp/new/news_release/2010/0310/index.html"target="_blank">source</a><br />
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		<title>Development of New energy Saving Cooling Fan by SANYO DENKI</title>
		<link>http://japantechniche.com/2010/03/12/development-of-new-energy-saving-cooling-fan-by-sanyo-denki/</link>
		<comments>http://japantechniche.com/2010/03/12/development-of-new-energy-saving-cooling-fan-by-sanyo-denki/#comments</comments>
		<pubDate>Fri, 12 Mar 2010 12:58:29 +0000</pubDate>
		<dc:creator>sia</dc:creator>
				<category><![CDATA[Green Tech]]></category>
		<category><![CDATA[Trendy Products]]></category>
		<category><![CDATA[Cooling Fan]]></category>
		<category><![CDATA[Development of new]]></category>
		<category><![CDATA[energy saving]]></category>
		<category><![CDATA[low power consumption]]></category>
		<category><![CDATA[PWM speed control function]]></category>
		<category><![CDATA[San Ace 80]]></category>
		<category><![CDATA[SANYO DENKI]]></category>

		<guid isPermaLink="false">http://japantechniche.com/?p=5082</guid>
		<description><![CDATA[Development of New energy Saving Cooling Fan by SANYO DENKI]]></description>
			<content:encoded><![CDATA[<p><img src="http://japantechniche.com/wp-content/uploads/2010/03/Sanyo-Denki-San-Ace-80.jpg" alt="Sanyo Denki San Ace 80" title="Sanyo Denki San Ace 80" width="241" height="241" class="alignleft size-full wp-image-5083" />Sanyo Denki does it again beating their own record in energy saving, by introducing yet another low power consumption cooling <a href="http://japantechniche.com/2010/02/11/development-of-industrys-top-energy-saving-and-lowest-sound-pressure-level-centrifugal-fans-by-sanyo-denki/">fan</a> targeted for such application as server, storage, communication equipment, power supply. The power consumption in this newly developed “San Ace 80” has been reduced by approximately 20% and the sound pressure has been reduced by approximately 2dB (A) compared to company’s previous fan. <span id="more-5082"></span><br />
The new “San Ace 80” features PWM speed control function for external fan speed control. The new fan comes in a form factor of 80 x 80 x 38 mm and weighs only 160 gram. The company is planning monthly sale of 30,000 units. The product is already available for shipping.<br />
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