Development of Coreless Organic Substrate for Enhanced Electrical Performance
Shinko Electrical Industries has announced the volume production of coreless substrate DLL3®, providing design flexibility, enhanced electrical performance at a thinner format. The DLL3s are manufactured by alternately forming insulator layers and copper plated circuit layers (build-up layers) simultaneously on both sides of core layer that is made of resin and glass cloth. Each insulator layer has laser formed micro vias to electrically connect the copper circuit layers on each side of the insulator layer. Read more
