Dai Nippon Printing has announced the launch of new POP power supply system capable of recycling the power form in-house lighting through its mounted PV panels on merchandise display cases. The new POP will provide an easy installation throughout the store without having to think about the location of electrical outlets. The expected price tag for newly developed eco-friendly POP is less than 200,000 JPY, which includes a set of 10 POP with LED, a photovoltaic panel and distributor. Read more
Dai Nippon Printing will start the full scale launch of luminescent poster incorporating a high intensity white light emitting inorganic Electro-Luminescent (EL) panel with printed materials and images that change similar to animated presentations. In developing this new luminescent poster, DNP has applied the high intensity illumination light sources from inorganic EL to the back of the color printed images in a segment format, which is format that is used for displaying patterns involving multiple display parts which flicker ON and OFF, resulting in images that stand out in a similar way as those in animated presentations. The posters panels can be manufactured in flexible materials, such as plastics and it can be attached to curved surfaces such as columns. In addition to this, the new displays offer a wider viewing angle than LCD displays. Read more
Dai Nippon Printing has successfully developed the world’s smallest Near Field Communications (NFC) compatible module for mobile terminals. The newly developed NFC is compatible with FeliCa®, Type A and B contactless smart cards operating under different communications standards. The new NFC uses a single reader-writer capable of communicating between mentioned multiple cards, making it ideal for use in office based notebook PCs and printers as well as in mobile devices. Read more
Encapsulants are critical building component of PV modules, come as a sheet material responsible for protecting PV cells and collectors circuits from external environment, requiring these materials to have a high level of weather resistance and prolong reliability.
Due to high cost of PV solar cells, there has been a recent tendency to thin down the crystal silicon, however, thin silicon has the tendency to break or crack, leaving manufacturer with alternative of thickening the encapsulants.
Based on this, Dai Nippon Printing has successfully developed a CVF1, polyolefin encapsulants, which is suitable to be used within crystalline silicon photovoltaic (PV) cells. Read more
Development of Data Conversion Software Capable of 3D Printing of Characters and Logos with Computer Graphics (CG) by DNP
DNP has made an announcement on development of 3D printing software (DynaCube 3D) capable of 3D printing of characters and logos at a low cost and short lead time. The new software was jointly developed with a group of researchers at the Tokyo University of Agriculture and Technology under the supervision of Professor Yasuhiro Takagi back in 2008, as a 3D printing technology producing dynamic and in-depth expressions even when viewed with the naked eye. The software is capable of recreating 3D expression in the form of printed materials by taking the image data and converting it to 3D printing data prior to printing, then attaching the resulting image to a lenticular lens, which is a transparent sheet with a series of convex lenses lined up on the surface. Read more
By now we have seen all sort of shapes of them, attached to various items, yes, the IC tags which are designed to make the tracing and management of things much smoother. Well, DNP just unveiled its book dedicated IC tags plus mounting technology for facilitating rapid mounting of Tags, 12,000 tags per hour matching speed to be exact. The new tag which has a breath of 10mm, are design to allow for mounting in the spine of books. Read more
Dai Nippon Printing (DNP) has successfully developed a technology for manufacturing world’s first Printed Wiring Boards (PWB) with embedded wire-bonded high performance IC chip. The newly developed PWBs contain approximately 40-pin components which are mounted using soldering.Through use of this technology, it is possible to embed over 700-pin components, in addition of meeting a lower profile and higher density. Read more
Development of the World’s Slimmest Printed Wiring Board with Embedded IC Chips and Passive Components by DNP
Following its success by its announcement of developing and mass producing of printed wiring board (PWB) with embedded passive components, DNP made another stride by announcing on development of world’s slimmest PWB with embedded IC chips as well as passive components such as condensers and resistors, a response with a overwhelming market demand for higher density PWBs, due to increased needs for slimmer and more compact components or digital equipments such as mobile phones. Read more
Dai Nippon Printing companies made an announcement on development of its 4th generation retransfer card printer. The newly developed CX-D80 can be used for variety of ID cards as well as other printing applications. The CX-D80 features a gloss photo; edge-to-edge printing and it would remain free of head damage thanks to the retransfer method. Furthermore, the CX-D80 is designed to accommodate various encoding applications such as magnetic encoding, smart card, RFID as well as single and dual sided printing. DNP is planning to introduce a new laminator CL-600 sometimes by first quarter of 2010. Read more
Brand tags and labels which are attached to products such as clothing, bags, and shoes provide information on the brand name, size, and country of manufacture and also play a role in preventing forged and counterfeited goods. Counterfeiting is a big business around the world hurting businesses and consumer alike every year making businesses to search for a solution which would allow the consumer to easily recognize an authentic item, based on this need Nippon DOM and DNP have jointly developed HOLOTRANS a heat-transfer holographic labels which can be attached to fabric products such as clothing, bags and shoes which is able to withstand both washing and dry-cleaning. Read more