Development of New Technology for Embedding High-Performance IC Chip by DNP

March 18, 2010 · Filed Under Trendy Products · 5 Comments 

DNP new PWB 2Dai Nippon Printing (DNP) has successfully developed a technology for manufacturing world’s first Printed Wiring Boards (PWB) with embedded wire-bonded high performance IC chip. The newly developed PWBs contain approximately 40-pin components which are mounted using soldering.Through use of this technology, it is possible to embed over 700-pin components, in addition of meeting a lower profile and higher density. Read more

Development of scalable High-Speed MRAM technology for system LSI Embedding by NEC

June 24, 2009 · Filed Under Green Tech, Trendy Products · 3 Comments 

Due to the progress in reducing cell size and the large capacity of system LSI, power consumption has increased. The current demands require reduced power consumption, which is partially accomplished by switching off during stand-by mode, a function that requires easy-use nonvolatile memory. In response to these market demands, NEC developed the world’s fastest SRAM-compatible MRAM with operation speed of 250 MHz in November 2007, and 32 Mbit MRAM for embedding in SoCs in February 2009. Read more

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