Development of new Heat-dissipating sheet by Hitachi
July 22, 2009 · Filed Under Trendy Products · Comments Off
Today’s electronic components require heat dissipating materials or otherwise know as Thermal Interface Material (TIM) capable of transferring generated heat by high-tech devices to cooling modules. Normally, the high thermal conductive materials are usually difficult to work with due to their increasing hardness. At the same time more flexible materials offering a good adhesion feature a low thermal conductivity leading researches to seek for a new material that offer a good balance between thermal conductivity and flexibility. Read more
