Development of Low-Melting Glass to be used as Low Temperature Sealant
Hitachi and Hitachi Chemical have jointly developed a 220-300 degrees Celsius, low-melting temperature glass (“low-melting glass”). The glass has been developed as a low temperature sealant which does not contain regulated materials such as lead or halogens such as fluorine or iodine. The new product is relatively inexpensive in comparison to gold-tin solder, a conventional low-temperature sealant, while providing better sealant properties than adhesive resins against air and moisture. Read more
Development of Isotropic Insulating Adhesive Sheets with High Thermal Conductivity
Hitachi Chemical has developed an electrically insulating adhesive sheets featuring high and isotropic thermal conductivity. Its thermal conductivity is at 40 W/mk in all in-plane directions as well as through their thickness. This has been achieved by improving thermo conduciveness of epoxy resin composites which includes curing agent through control of higher-order structure by self-alignment developed by the company. In developing this product Hitachi Chemical has developed resin composites with low melt viscosity which can be loaded with large amounts of BN filter and by establishing the process of randomly dispersing and highly filling the BN filter. Read more
[CEATEC] Hitachi Chemical Showcases its Super-compact RFID Tag
Hitachi Chemical has showcased its ultra-small package RFID tag suitable for wide range of applications. The new RFID tag was co-developed with Hitachi by incorporating the semiconductor packaging technologies along with antenna design technologies and semiconductor material technologies which were developed for the Microwave frequency “u-chip”. The product has a form factor of 2.5mm square and thickness of 0.3mm. It contains an antenna with communication range of 20mm with a generic RFID reader. But the range can be improved to several meters with inclusion of external antenna. Read more
Construction of Basic Patent Network for the Double-Layered Anisotropic Conductive Films by Hitachi Chemical
Hitachi Chemical has announced the construction of basic patent network for double-layered anisotropic conductive films. The new conductive films are ideal for connection with circuits formed on different types of adherents. Typically, the anisotropic conductive films are used for circuit connection in flat panel displays such as liquid crystal displays, in mobile handsets. It is a core technology for connecting multiple microcircuits. Read more
Development of a Conductive Film for Bonding Tab ribbon for Solar Cells by Hitachi Chemical
Hitachi Chemical announced the development of “CF Series”, a conductive film for bonding tab ribbon when connecting crystalline silicon solar cell in a series formation. In addition to this the new conductive film can be applied to thin film as well as organic compound PV modules. Development of the new conductive thin film was in a direct response to find an alternative material to solder in the case of a thin film. Currently, solder is used for connecting a tab ribbon to a bus bar; however soldering requires a high temperature which imposes stress on the cell, resulting in a bend or even a crack. Read more
Development of new Heat-dissipating sheet by Hitachi
Today’s electronic components require heat dissipating materials or otherwise know as Thermal Interface Material (TIM) capable of transferring generated heat by high-tech devices to cooling modules. Normally, the high thermal conductive materials are usually difficult to work with due to their increasing hardness. At the same time more flexible materials offering a good adhesion feature a low thermal conductivity leading researches to seek for a new material that offer a good balance between thermal conductivity and flexibility. Read more
