Development of Static Pressure soldering technology by OKI
As machines in industrial electronic field are becoming faster and highly integrated making the printed wire boards (PWBs) to become larger and multilayered. Additionally with the growing trend in use of lead free soldering making it difficult to assemble machines. For instance, on a PWB with a area of 460 x 500mm and thickness of 4mm there are cases where a mix of over 10,000 surface-mounted components and insertion components must be soldered to it all by using lead-free material. Furthermore, to make this more of a challenge, installing an insertion component requires one to first perform reflow soldering of the surface-mounted components on both sides of the PWB, then insert the component terminal in the PWB’s through-hole, and then perform soldering. In conventional soldering method where soldering irons or flow soldering machine is being used , under filling of the through-hole can occur which is caused due to lack of heat or non-stable solder filling. But applying high degree of heat using soldering iron technique in order to avoid under filling may cause the cutting of internal layer patterns of PWB. Read more
