Development of New energy Saving Cooling Fan by SANYO DENKI
Sanyo Denki does it again beating their own record in energy saving, by introducing yet another low power consumption cooling fan targeted for such application as server, storage, communication equipment, power supply. The power consumption in this newly developed “San Ace 80” has been reduced by approximately 20% and the sound pressure has been reduced by approximately 2dB (A) compared to company’s previous fan. Read more
Development of Industry’s Highest Capacity Compact HDD by TOSHIBA
Toshiba today unveiled yet again another small form factor hard disk drives targeted for enterprise applications. The new high performance, low power HDD is a new MBF2600RC family of HDDs bringing 2.5-inch drives into the enterprise space. The new product line-up features a 600GB drive and rounds out the range with 300GB, and 450GB capacities with maximum rotation speeds of over 10,000RPM. The highest areal density of 595Mbit/mm2 (384Gbpsi) and 600GB capacity on these new 2.5-inch HDDs has been achieved through improvements in both the magnetic recording head and disk’s magnetic layer. Furthermore, the internal transfer rate has been increased by 13% from 191.5MB/s to 216MB/s; thanks to improved linear recording density and overall performances through high speed seek time. Read more
Development of Millimeter-Wave Intra-connection Wireless Technology by SONY
Millimeter waves are electromagnetic waves with a frequency range of between 30GHz to 300GHz, and wavelength between 1mm to 10mm. With their inherent high frequency, millimeter waves are best suited for ultra high speed data transfer. Their advantage goes further through their ability of transferring data in such high speed with use of very small antennas. With today’s multi-functional electronic equipments there is an increasing amount of internal data transfer which wired connected approach will soon its limit in data capacity, requiring an additional circuitry to accommodate a larger data transfers, however this approach will result in increasingly complex IC packages, intricately printed circuit boards not to mention a larger IC sizes. Millimeter wireless technology offers a promising choice in fulfilling this need. Base on this technology and in the face of coming shortage in data capacity, Sony made an announcement on development of millimeter wave wireless intra-connection technology capable of high speed wireless data transfer inside electronic products such as television sets. Read more
World’s first low power consumption memory for digital consumer electronics with operating temperature of 125 degrees Celsius by Fujitsu
As demand for higher performance and faster as well as low cost consumer products continues, the use of System-in-packages (SiPs) which combines for instance a memory chip with a SoC in such product becomes a necessity. The use of SiPs will help to reduce the number of necessary components and board space resulting in reduction in overall system costs.
Until now, conventional memory provided limitation to SiP usage since the conventional memory can only operate at up to 95 degrees Celsius making the SiP configuration unsuitable where high performance SoC with a large power consumption can generate heat where the SiP temperature can reach 105 degrees Celsius. Use of conventional memory in a SiP configuration so far required an addition of heat disperser such as heat-sink to reduce the SiP temperature to an operationally feasible 90 degrees Celsius; however this solution will come with an increase cost and size. Read more
