Shinko Electrical Industries has announced the volume production of coreless substrate DLL3®, providing design flexibility, enhanced electrical performance at a thinner format. The DLL3s are manufactured by alternately forming insulator layers and copper plated circuit layers (build-up layers) simultaneously on both sides of core layer that is made of resin and glass cloth. Each insulator layer has laser formed micro vias to electrically connect the copper circuit layers on each side of the insulator layer. Read more
If you thought the prices on some of the flat screens in the market are too high think again, here is the ultimate high end USB Flash Drive designed by SolidAlliance Corporation. The price tag for this very new and unique USB memory is 1,000,000 yen Taxes are not included. The newly deigned USB which company calls it “MNEMOSYNE” coincides with company’s seventh anniversary. The “MNEMOSYNE” was the memory goddess of ancient Greece. The “MNEMOSYNE” is a cube measuring 72mm on each side consisting of 5 polished silver pieces and one black piece which holds the 16G USB Flash Drive housed in the inner part of the body of “MNEMOSYNE”. It is really a cubic puzzle with the design concept that precious memories must be stored in fashion to be used with care and attention. The user will not be able to get to the memory part of the “MNEMOSYNE” without disassembling it. Read more
World’s first low power consumption memory for digital consumer electronics with operating temperature of 125 degrees Celsius by Fujitsu
As demand for higher performance and faster as well as low cost consumer products continues, the use of System-in-packages (SiPs) which combines for instance a memory chip with a SoC in such product becomes a necessity. The use of SiPs will help to reduce the number of necessary components and board space resulting in reduction in overall system costs.
Until now, conventional memory provided limitation to SiP usage since the conventional memory can only operate at up to 95 degrees Celsius making the SiP configuration unsuitable where high performance SoC with a large power consumption can generate heat where the SiP temperature can reach 105 degrees Celsius. Use of conventional memory in a SiP configuration so far required an addition of heat disperser such as heat-sink to reduce the SiP temperature to an operationally feasible 90 degrees Celsius; however this solution will come with an increase cost and size. Read more
The “Green” has no relevance to “Green IT” in this product what so ever but it is rather a soothing color for this cuddly toy like USB memory holder. USB came a long way from its little boring technology stick to its early adaptors in becoming a part of your interior design. Read more