Release of “Calypso” a Single-Chip Solution for Hybrid Automotive Instrument Cluster by FUJITSU Semiconductor
Fujitsu Semiconductor has announced the release of company’s first FCR4 family of devices, based on ARM® Cortex™, R4 core operating at up to 160MHz while offering in excess of 200 DMips processing power. The newly developed “Calypso” is a cost-effective single-chip solution for hybrid automotive instrument clusters, capable of supporting up to 6 traditional gauge as well as 2D graphics engine “IRIS” for driving a color display all in the same cluster. It comes with 2Mb of Flash memory, 64KB of EEFlash plus 208KB of RAM, all protected by ECC. Read more
Development of Coreless Organic Substrate for Enhanced Electrical Performance
Shinko Electrical Industries has announced the volume production of coreless substrate DLL3®, providing design flexibility, enhanced electrical performance at a thinner format. The DLL3s are manufactured by alternately forming insulator layers and copper plated circuit layers (build-up layers) simultaneously on both sides of core layer that is made of resin and glass cloth. Each insulator layer has laser formed micro vias to electrically connect the copper circuit layers on each side of the insulator layer. Read more
