Toshiba made an announcement on development and launch of a 64 gigabyte (GB) embedded NAND flash memory module, the highest capacity in the industry. The chip is in full compliance with e-MMC(TM) standard, targeted for various digital consumer products such as smart phones, mobile phones, netbooks and digital video cameras. The new chip combines sixteen 32Gbit (equal to 4GB) NAND chips and dedicated controller thanks to Toshiba’s 32nm process technology which includes application of chip thinning and layering technologies in achieving a thickness of only 30 micrometers for each individual chip. Toshiba is the first company in succeeding to combine 16 NAND chips. Read more
With the current move of semiconductor industry toward 32nm manufacturing process technology, Toshiba made an announcement of shipment of its newly developed 32 nm NAND flash memory approximately two month ahead of earlier announced schedule. The newly developed flash memory will be targeted for use in memory cards and USB memory devices and later on to be implemented in to other embedded devices according to Toshiba. The new chip is capable of storing up to 4GB of data. The sample of this new chip is available immediately with the commercial production to take effect sometimes in July. Toshiba mentioned that the newly 32nm NAND flash memory chip will be manufactured at company’s Yokkaichi plant in Mie prefecture in Japan.