Development of New Package Design Technology For Implementation of Next Generation DDR4 Interface on a Wire-Bonding BGA Package by RENESAS
June 11, 2010 · Filed Under Trendy Products · 2 Comments
Renesas Electronics made an announcement on development of novel package design technology which encompasses accurate electromagnetic (EM) analysis of the complex interactions between signals, power supplies and ground inside the wire-bonding Ball Grid Array (BGA) packages using an electromagnetic analysis tool developed by Physware, and accurate simulation method of the simultaneous switching output of the package devices. Read more
