Development of Ultra-Compact Microchip Packaging Technology by RENESAS
November 4, 2010 · Filed Under Trendy Products · 1 Comment
Renesas Electronics has announced the development of a ultra-compact packaging technology that achieves miniaturization at the bare chip level for use in microcontroller unit (MCU) products. The new technology employs wafer-level redistribution technology which is called FO-WLP (Fan-Out wafer-Level Package) technology, ideal for ultra-compact MCU products. Read more
