Development of Pattern Transfer and Bonding Technology using Sub-Micron Sized Gold Particles
August 15, 2011 · Filed Under Trendy Products · Comments Off
Tanaka Kikinzoku Kogyo along with SUSS MicroTec will jointly develop technology for transferring patterns of sub-micron gold particles to a silicon wafer at the low temperature of 150 degrees Celsius on an industrial high volume production basis. Utilizing the new technology will make it possible to achieve metal-metal bonding on a water level at the low level temperature, as low as of 200 degrees Celsiu, which so far has been difficult using the conventional technology. Read more
