Development of New Dry Film Photoresists by Shin-Etsu
July 31, 2009 · Filed Under Trendy Products · 2 Comments
Shin-Etsu MicroSi a leading Japanese company in development of Organic and Inorganic chemicals, Electronic Materials as well as Functional materials has developed a new dry film photoresists targeted at 3D Through Silicon Vias and 2-dimentional wafer bonding applications. A through-silicon via is a vertical electrical via passing completely through a silicon wafer or die. TSV technology is important in creating 3D packages and 3D integrated circuits. A 3D package contains two or more chips stacked vertically so that they can occupy less space. Read more
