Release of Super Speed Low-Power USB 3.0 Host Controller by Renesas Electronics
Renesas electronics has announced the release of two new high-speed USB 3.0 host controllers to be used in such devices as PCs and digital TVs. The new host controllers namely uPD720201 and uPD720202 will provide a easier path for system designer in building electronic devices combining high-speed data transfer, compact form factor as well as extend battery life. In addition to this, the two host controllers come with Renesas device drivers for Microsoft Windows and Linux. The two new host controllers come with a new four-port, contributing to faster speeds, improved power efficiency (4.5 milliwatt in low-power mode) and reduced size of approximately 50% that Renesas previous USB 3.0 host controllers. Read more
RENESAS Unveils its New Low Power Consumption USB 3.0 Host Controller
Renesas Electronics announced the availability of its newly developed SuperSpeed Universal Serial Bus (USB 3.0) host controller with 85% reduced power consumption when peripheral devices such as mice are not connected to the ports. The new uPD720200A device offers a data rates of up to 5 gigabits per second (Gbps), while achieving a low power consumption of 50 milliwatts (mW) with no peripheral connection to the ports. Read more
Development of Industry’s First Thin-Film Common Mode Filter featuring High Speed Differential Transmission Common Mode Noise Suppression and ESD Protection in a Single Component
TDK-EPC has successfully developed the world’s first thin-film common mode filter featuring both high-speed differential transmission common mode noise suppression and ESD (Electrostatic discharge) protection all in a single component. The new filter has a form factor of (1.25 x 1.00 x 0.60 mm3), using the proprietary thin-film circuit formation and materials technologies. Successful addition of ESD suppressor function to the already existing EMI (Electromagnetic interface)function in this newly developed filter has helped to eliminate any needs for additional varistor for ESD suppression, resulting in reduced number of components and mounting area, as well as further miniaturization of mobile devices. Read more
NEC Unveils New LSI Technology for Next Generation High Speed Serial Communication Interfaces
With rapid increase in volume of data that is being process for personal use due to existence of multitude of high functionality equipment such as HD TV and 3D video content has resulted in a greater demand for high speed communication of data both between and within a wide variety of equipments. In order to cope with such overwhelming demand, various types of sophisticated transmission schemes have been proposed to compensate for the large waveform distortion of input signals fed to the receiver, in order to reach a communication speed of 10 Gb/s to accommodate the next generation USB and PCI Express. However, due to complexity of some of the transmission scheme, their application has been limited, as they are not compatible with widely used binary transmission schemes currently used in USB and PCI Express. Based on this need, NEC and NECEL have developed a new high speed communication interface technology that utilizes binary transmission schemes capable of data transmission rates of 16Gb/s which is 3 times faster than the existing communication interface standards such as USB 3.0 and PCI Express 2.0. Read more
USB 3.0 prototype by Fujitsu Microelectronics
After its demonstration on September 18th of 2008 at Intel Developer Forum and completion of its specification on November of 2008, USB 3.0 spec. is open to hardware developers for implementation in future products. The new feature in USB 3.0 is its “SuperSpeed” bus designed to increase the maximum data transfer rate to 5.0 Gigabits per second a 10 fold over its predecessor USB 2.0 . Read more
